Product Name: Cobalt Disilicide (CoSi2) 
Specification: 0.8-10um (D50) 
Appearance: Irregular 
Color: Black Grey 
Features: low resistivity, good thermal stability 
Purpose: Large scale integrated circuits

Cobalt Silicide

Chemical formula: CoSi2

Molecular weight: 115.104

CAS number: 12017-12-8

EINECS number: 234-616-8

Density: 5.3g/cm3

Melting point: 1277 ℃

Lattice constant: a=0.535nm

Crystal system: cubic crystal system

Appearance: Grey silicide ceramic powder

Solubility: Insoluble in water

Property: Low resistivity: As a key component of low resistance contacts and interconnects in microelectronics. High temperature stability and oxidation resistance: the core ability of high-temperature coatings to protect substrates. Compatibility with silicon technology: Easy to integrate into standard silicon-based integrated circuit manufacturing through self-aligned silicification process. Good silicon interface characteristics: the ability to form ohmic or Schottky contacts. Potential thermoelectric performance: as a candidate for environmentally friendly thermoelectric materials. High hardness and wear resistance: potential as a wear-resistant coating.

Nature and stability: It will not decompose when used and stored according to specifications. CoSi2 can react with hot hydrochloric acid, soluble in hydrochloric acid but insoluble in sulfuric acid. Can be corroded by aqua regia, concentrated nitric acid, strong alkaline solutions, and molten hydroxides and carbonates. Can undergo chemical reactions with hydrogen sulfide, hydrogen fluoride, hydrogen chloride, fluorine, chlorine, etc.

Synthesis method:

Mix cobalt powder and silicon powder evenly according to the chemical composition ratio of CoSi2, melt them under isolated air conditions, and keep them at 1150 ℃ for 100 hours to fully homogenize them. The product is CoSi2 that is close to a single phase.

Purpose:

1) Cobalt silicide (CoSi₂) is a widely used material for connecting metals and semiconductors, serving as an inter connect between the semiconductor base electrode and metal wires in devices.

2) Contact and interconnect materials: This is the most important and widely used application area of cobalt silicide. CoSi ₂ has a relatively low resistivity (about 18-25 μ Ω· cm), good ohmic contact characteristics with silicon substrates, and can be formed through self-aligned silicification process. It is often used as a contact material for the gate, source, and drain of MOSFETs (metal oxide semiconductor field-effect transistors), as well as a local interconnect material, which can effectively reduce contact resistance and interconnect resistance, improve device performance and integration.

3) High temperature antioxidant coating

Cobalt silicide (especially CoSi₂) has a high melting point and good high-temperature stability.

It can form a dense and adhesive silicon dioxide protective film on its surface under high-temperature oxidation environment, effectively preventing oxygen from diffusing into the substrate, thereby protecting the metal or alloy substrate (such as cobalt based high-temperature alloys, molybdenum, niobium and other refractory metals) from high-temperature oxidation and corrosion. This makes it potential for applications that require extreme environmental protection, such as gas turbine blades, aircraft engine components, and high-temperature furnace components.

4) Thermoelectric materials:

Some cobalt silicide compounds, such as Higher Manganese Silicides doped with cobalt or specific Co Si phases, have been studied as potential thermoelectric materials in the mid temperature range. Thermoelectric materials can directly convert heat (waste heat) into electrical energy. The cobalt silicide system has attracted attention due to its relatively high thermoelectric performance, environmental friendliness (without expensive or toxic elements such as Te, Pb), and good thermal stability.

Packaging and storage: This product is packaged in an inert gas filled plastic bag, sealed and stored in a dry and cool environment. It should not be exposed to air to prevent moisture from causing oxidation and aggregation, which may affect dispersion performance and usage effectiveness; The packaging quantity can be provided in separate packages according to customer requirements.