Product Name: Tantalum Nitride (TaN) 

Specification: 0.8-10um (D50) 
Appearance: Irregular 
Color: Black Grey 
Features: high hardness, wear resistance, chemical inertness, thermal stability, and low temperature coefficient of resistance 
Application: Wear resistant coating, thin film resistor, and diffusion barrier in integrated circuits

English name: Tantalum Nitride 
CAS number: 12033-62-4 
Density: 13.4 g/cm3 
Crystal form: Black hexagonal crystal 
Melting point: 3090 ° C 
Chemical formula: NTa 
Electrical resistivity: 128 μ Ω· cm 
Thermal conductivity: 9.54W/(m · K) 
Molecular weight: 194.95500 
Accurate quality: 194.95100 
Microhardness: 1100kg/m2 
Thermal conductivity: 9.54W/(m · K) 
Lattice constants: a=0.4336nm, c=0.4150nm 
Water solubility: insoluble in water and acid, slightly soluble in aqua regia, soluble in potassium hydroxide and decomposed to release ammonia. Heating to 2000 ℃ releases nitrogen gas. 
Preparation method 
1. Metal tantalum powder is directly nitrided with nitrogen or ammonia at around 1100 ℃. 
2. Preparation of tantalum nitride using tantalum metal and nitrogen gas as raw materials, the reaction equation is as follows: 2Ta+N2=2TaN 
Metal tantalum powder is directly nitrided with nitrogen or ammonia at around 1100 ℃. 
Function/Application 
1. The material used to manufacture precise sheet resistors, tantalum nitride resistors can resist the erosion of water vapor. In the process of manufacturing integrated circuits, these films are deposited on top of silicon chips to form thin film surface mount resistors. The material used to manufacture sheet resistors, tantalum nitride resistors can resist the erosion of water vapor. Tantalum nitride material is used to make protective layers for chip wires. 
2. Used as an additive for superhard materials, pure tantalum pentachloride can be prepared for spraying, increasing the electrical stability of transformers, integrated circuits, and diodes. 
Packaging and storage: This product is packaged in an inert gas filled plastic bag, sealed and stored in a dry and cool environment. It should not be exposed to air to prevent moisture from causing oxidation and aggregation, which may affect dispersion performance and usage effectiveness; The packaging quantity can be provided according to customer requirements, with sub packaging